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| Year of Publication |
1999
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| Journal |
Journal of Applied Physics 86 (9), 4916-4921, 1999
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Publications
Roughness evolution of CuSn intermetallic during soldering
Department Chair & Professor Of Mechanical Engineering (Office: BG.53)
Citation: 1.Roughness evolution of CuSn intermetallic during soldering. Journal of Applied Physics 86 (9), 4916-4921, 1999. 1999.
In: Journal of Applied Physics 86 (9), 4916-4921, 1999
Published by: AS Zuruzi, CH Chiu, SK Lahiri, KN Tu , 1999
google Scholar link: https://scholar.google.com/citations?view_op=view_citation&hl=en&user=lBV1GBAAA…
Cited by: 55